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The Accelerated Thermal Cycling Testing is performed to determine the resistance of packaging materials to exposure to extreme high and low temperatures. With the Accelerated Thermal Cycling Testing, it is aimed to detect thermal incompatibility on the material, cracking and warping of the solder joint, damage to the tips and markings, and hermetic seal failures.
In particular, it can be evaluated in terms of thermal cycling resistance that the adhered packaging materials can have different thermal expansion and contraction coefficients. With the Accelerated Thermal Cycling Testing, the presence of thermal coefficient mismatches and the sensitivity of these mismatches to repeated temperature changes are determined.
Accelerated Thermal Cycling Testing can be performed on packaging materials according to the conditions specified within the scope of the relevant standard, and the rate of impact of the packaging material from environmental conditions can be interpreted.